Product Engineer - II or Sr. Product Engineer, Texas Institute Electronics
Listed on 2025-12-30
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Engineering
Electrical Engineering, Electronics Engineer, Systems Engineer
Job Posting
Title:
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Hiring Department:
Cockrell School of Engineering----
Position Open To:
All Applicants----
Weekly Scheduled
Hours:
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FLSA Status:
Exempt----
Earliest
Start Date:
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Position Duration:
Expected to Continue----
Location:
PICKLE RESEARCH CAMPUS----
Job Details:
About UsThe Texas Institute for Electronics (TIE) is a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Our mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. We are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc.
We are seeking a number of motivated individuals to join our team and help us in achieving the above goals.
TIE is part of the Cockrell School of Engineering at The University of Texas at Austin (UT Austin), a global leader in technology innovation and engineering education for over a century. With 11 undergraduate and 13 graduate programs, over 20 research centers and a faculty community that boasts one of the highest number of National Academy of Engineering members among U.S. universities, Texas Engineering has launched some of the nation's most accomplished leaders and pioneered world-changing solutions in virtually every industry, from space exploration to energy to health care.
Situated in the heart of Austin - named "America's Coolest City" by Expedia and "The Best Place to Live in the U.S." by U.S. News and World Report - the Cockrell School embodies the city's innovative spirit. Major companies with Austin campuses, such as Dell, National Instruments, Apple, IBM, Samsung, Google, Tesla, and many others, continue to recruit Cockrell School students at a remarkable rate, launching thousands of successful careers and developing Texas Engineers into industry leaders.
At UT Austin, we say "What starts here changes the world." As a member of the university community, you will be part of an organization that is internationally recognized for our academic programs and research. Your work will have meaning and make a difference not only in the lives of our faculty, staff, and students, but also those who are impacted by our first class academic and research programs.
UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:
Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with 7.75% employer matching funds
Additional Voluntary Retirement Programs:
Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)Flexible spending account options for medical and childcare expenses
Robust free training access through Linked In Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets.
Free access to UT Austin's libraries and museums with staff
Free rides on all UT Shuttle and Austin Cap Metro buses with staff
Multiple vacancies available. This position may be filled at a higher-level title, relative to the experience and qualifications of the selected candidate. Applicants must be authorized to work in the United States on a full-time basis for any employer without sponsorship. Relocation assistance may be available.
We are bringing advanced semiconductor 3
DHI packaging/manufacturing back to the USA and looking for motivated individuals to join our team.
Responsible for IC & Test Structure product validation and optimization of manufacturing & Design processes to improve 3
DHI yield, performance, & reliability across a wide range of customer heterogenous materials and micro-systems. Work closely with circuit/layout design, process integration, and TEST teams to define and create work flow solutions, and methodologies to ensure products produced at TIE have the highest possible performance, quality, & reliability.
Product and test vehicle validation to specifications, development and optimization of manufacturing/test workflows, 2.5D/3D modeling accuracies, creation of BKM's (Best Known Practices) to comprehend and optimize Power/Thermal/Mechanical/Signal Integrity/RF impacts of multi-chiplet and multi-domain heterogeneous micro-systems.
Contribute to the design and development of 2.5D & 3D advanced packaging solutions for semiconductor devices. Develop and support TIE's 3D-ADK (Assembly Design Kit).
Interpret fab metrology, defect, E-test yield, and evaluate…
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