3D Packaging Engineer - Advanced Packaging Innovator
Listed on 2026-10-06
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Engineering
Packaging Engineer
Advanced Micro Devices in Austin, TX, seeks an experienced Advanced Packaging Engineer to drive technology development of 3D package architectures. You will execute proof of concept, bring up products, and improve yield and reliability to meet performance and cost goals.
The candidate should have hands‑on BEOL/TSV and Hybrid bonding experience, strong design/reliability skills, and excellence in communication with partners and stakeholders. This role is hybrid and visa‑not‑sponsored.
Consider building your career as a 3D Packaging Engineer - Advanced Packaging Innovator at Advanced Micro Devices.
The position is based in Austin, TX, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 120..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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