ASIC Packaging Design Intern; Co-op
Listed on 2026-10-06
-
Engineering
Engineering Design & Technologists, Packaging Engineer
Advanced Micro Devices is seeking a highly motivated ASIC Package Engineering intern/co-op to join our team in Austin, TX or Boxborough, MA. You will work full time in a hybrid or onsite structure for the co-op/intern term.
As a student in Electrical, Computer, or Mechanical Engineering (or related fields), you will assist with substrate, interposer and bump design, design verification, and yield analysis while collaborating with experienced engineers on real AMD products.
We have an opening for a ASIC Packaging Design Intern (Co-op) in Austin, TX, United States within Engineering.
As a ASIC Packaging Design Intern (Co-op), you will play an important part at Advanced Micro Devices in Austin, TX, United States.
We invite applications for the ASIC Packaging Design Intern (Co-op) position located in Austin, TX, United States.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).