Senior Packaging Engineer Gen SoCs; Equity
Listed on 2026-10-07
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Engineering
Packaging Engineer
Velaura is building next-generation compute technology for cloud, edge, and Physical AI. Our packaging role leads architecture and development from concept through production, collaborating with silicon, board, thermal, and manufacturing teams to deliver high-performance, manufacturable products.
The ideal candidate has deep experience in advanced semiconductor packaging, package-level SI/PI, and cross-functional optimization to balance performance, cost, and yield.
We invite applications for the Senior Packaging Engineer – Next-Gen SoCs (Equity) position located in Austin, TX, United States.
As a Senior Packaging Engineer – Next-Gen SoCs (Equity), you will play an important part at Velaura in Austin, TX, United States.
The following position is for a Senior Packaging Engineer – Next-Gen SoCs (Equity) with Velaura.
Our group is growing, and we are hiring a Senior Packaging Engineer – Next-Gen SoCs (Equity) in Austin, TX, United States.
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