Senior Flip-Chip Packaging Engineer, .5D/3D
Listed on 2026-10-07
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Engineering
Packaging Engineer
Conductor seeks experienced engineers to contribute to flip chip package development and assembly for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This role covers bump metallurgy, substrate integration, reflow, underfill, reliability, and cross-functional support for package and system productization.
Responsibilities include developing attach processes, defining bump stacks, enabling die-to-substrate integration, and mitigating risks such as warpage and voiding.
Join us at Conductor as our next Senior Flip-Chip Packaging Engineer, 2.5D/3D in Austin, TX, United States.
We invite applications for the Senior Flip-Chip Packaging Engineer, 2.5D/3D position located in Austin, TX, United States.
The following role is for a Senior Flip-Chip Packaging Engineer, 2.5D/3D with Conductor.
Our group is growing, and we are hiring a Senior Flip-Chip Packaging Engineer, 2.5D/3D in Austin, TX, United States.
This role is for the Senior Flip-Chip Packaging Engineer, 2.5D/3D role at Conductor.
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