Thermal & Mechanical Packaging Engineer - Data Center
Listed on 2026-10-09
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Engineering
Mechanical Engineer, Packaging Engineer, Systems Engineer
Annapurna Labs in Amazon's data center division seeks a Sr. Thermal & Mechanical Packaging Engineer to lead the design and optimization of high-volume semiconductor packaging for our world-scale computing infrastructure.
You will develop from the lowest circuit levels to full system designs, applying CFD/FEA methods and collaborating with vendors and internal teams to improve performance, reliability, and cost across AWS deployments.
Step into the Thermal & Mechanical Packaging Engineer
- Data Center role at Amazon Inc. in Austin, TX, United States and grow with us.
The advertised compensation is 185..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Thermal & Mechanical Packaging Engineer
- Data Center role in the description above.
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