Package Design Engineer

Position: Staff Package Design Engineer
Austin, Texas Global Operations – Global Operations /Full Time /Hybrid For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutions for the world's top consumer brands. Cirrus Logic is also known for its award-winning culture, which was built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn.

But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career! Are you ready to make a significant impact in a fast-paced, innovative environment?

We are seeking a Staff Package Design Engineer to join our dynamic team in Austin, TX. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.

This is a challenging design/layout position in a high volume, dynamic and fast paced environment, and will have a direct impact on business with external customers by helping create innovation that rocks. Products include top of the line Amps, Codecs and DSPs to name a few. The package design types are a wide variety from WLCSP to wirebond to flip chip.

This is a chance to be part of a package design team supporting challenging customer expectations and a growing business.

Key Responsibilities
· Design package layouts, stack-ups, drawings, models, simulations, and design documentation to verify compliance with requirements and design standards
· Work tightly with Global Design (UK and US) I.C. and board teams to drive package designs that meet Cirrus performance, reliability, and manufacturability requirements
· Interface with cross functional teams (Design, Layout) to define package requirements from electrical, thermal, and mechanical point of view
· Utilize AutoCAD, GDS tools, Siemens Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation, and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information
· Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB
· Collaborate with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages
· Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues
· Grow and promote automation processes throughout the package design flow
· Close collaboration with customers to resolve various design issues between the piece part and PCBRequired

Skills and Qualifications
· B.S. or higher degree in Mechanical or Electrical Engineering
· 5+ year's experience designing for manufacturability
· Experienced Cadence SiP layout user
· Strong AutoCAD user
· Knowledge of packaging technologies, materials, package substrate design, and assembly rules
· Understanding of electrical simulation results on a package design

Preferred

Skills and Qualifications
· Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)
· Broad reading in the area of interest and the desire to continue that reading with access to the high-quality company library resources, material properties knowledge
· Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training…