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Chip Lead

Job in Austin, Travis County, Texas, 78716, USA
Listing for: Silicon Laboratories Inc.
Full Time position
Listed on 2026-10-12
Job specializations:
  • Engineering
    Systems Engineer, Hardware Engineer, Electronics Engineer, Test Engineer
Salary/Wage Range or Industry Benchmark: 160650 - 298350 USD Yearly USD 160650.00 298350.00 YEAR
Job Description & How to Apply Below

Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power wireless connectivity, building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the world’s most highly integrated SoCs, Silicon Labs provides device makers the solutions, support, and ecosystems needed to create advanced edge connectivity applications. Headquartered in Austin, Texas, Silicon Labs has operations in over 16 countries and is the trusted partner for innovative solutions in the smart home, industrial IoT, and smart cities markets.

Learn more at

Chip Lead

The Role

The Chip Lead provides technical leadership for the architecture, design, integration, and execution of complex wireless System-on-Chip (SoC) products, from initial product definition through silicon bring-up and production. This role requires deep technical expertise in SoC architecture, microarchitecture, and design, including processor subsystems, memory architectures, interconnects, clock and reset architectures, low-power design, digital and mixed-signal IP, and wireless connectivity. The Chip Lead is responsible for translating product requirements into a cohesive SoC architecture, driving key technical decisions and design tradeoffs, and ensuring that the chip meets its functional, performance, power, area, and cost objectives.

The Chip Lead works hands-on with engineering teams to drive subsystem design, IP integration, verification, physical implementation, and design closure. The role requires the ability to identify and resolve complex technical issues, challenge design assumptions, evaluate architectural alternatives, and make informed engineering decisions across multiple disciplines. As the overall technical owner of the chip, the Chip Lead coordinates engineering execution across global design teams, establishes technical milestones, manages design dependencies and risks, and drives the SoC through tapeout, silicon bring-up, and production readiness.

Responsibilities
  • Lead the technical development and execution of complex wireless SoCs from product definition through design, silicon validation, and production.
  • Definition and Planning:
    Work closely with product marketing, systems engineering, and SoC architects to review product requirements and contribute to the definition of the SoC.
  • Serve as a key stakeholder in SoC architecture development, providing input on architectural decisions, design tradeoffs, technical feasibility, implementation complexity, and IP reuse.
  • Identify technical risks, integration challenges, and cross-functional dependencies early in the development cycle.
  • Develop the chip design execution plan, including technical milestones, design dependencies, and engineering resource requirements.
  • Provide technical design collateral and engineering assessments to support product approval gates.
  • Project Execution:
    Provide hands-on technical leadership throughout SoC design, integration, verification, and physical implementation.
  • Work closely with functional and subsystem leads to drive design execution, resolve technical issues, and ensure successful integration of all SoC components.
  • Review technical solutions, identify architectural and implementation issues, and collaborate with SoC architects and functional leads to resolve them.
  • Work with verification teams to ensure comprehensive SoC verification, including system-level functionality, interfaces, power modes, and critical use cases.
  • Drive technical readiness for tapeout, ensuring design completeness, verification closure, and resolution of critical design issues.
  • Represent the design community to provide succinct weekly status and attend the cross-functional meeting.
  • Drive design action items to closure.
  • Validation to…
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