Senior Packaging Engineering Leader – Data Center GPUs
Listed on 2026-10-16
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Engineering
Packaging Engineer, Operations Management
AMD is seeking a leader to drive the design execution of next-generation Data Center GPU and MI package programs. You will manage cross-functional teams across design, SI/PI, substrate vendors, OSAT partners, and program management to ensure successful execution against tight timelines.
The role requires strong program management, strategic thinking, and the ability to influence across global teams. You will champion AI-enabled automation, design methodologies, and data-driven decision making to
The Senior Packaging Engineering Leader – Data Center GPUs role at AMD is now open for applications in Austin, TX, United States.
The position is based in Austin, TX, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 180..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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