Lead C2C Bonding Engineer - Hybrid Wafer Integration
Listed on 2026-10-17
-
Engineering
Systems Engineer, Electronics Engineer
Samsung Austin Semiconductor is seeking a Copper-to-Copper (C2C) Bonding Expert to lead development, optimization, and integration of advanced wafer bonding technologies for next-generation CIS. You will drive innovations in hybrid bonding to enable stacked image sensors with improved yield and reliability, on-site in Austin.
The role requires 5+ years in Far BEOL/Module Integration and 3+ years in Bonding, with up to 10+ years in related areas.
We are seeking a motivated Lead C2C Bonding Engineer
- Hybrid Wafer Integration to join Samsung Electronics Perú in Austin, TX, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 131..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Lead C2C Bonding Engineer
- Hybrid Wafer Integration role in the description above.
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