Principal Packaging Engineer

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.

Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Job Description:

Skyworks is seeking a Principal Packaging Engineer in Nashua, NH or Austin, TX, to support the RF and Mixed Signal Intelligence Business Unit. This role will provide package-engineering leadership for new product introduction and support package design, material selection, assembly readiness, qualification, and production release. The position spans SOIC, lead-frame, QFN, LGA, BGA, and WLCSP package technologies and requires close collaboration with R&D, device and process engineering, module design, program management, operations, internal assembly sites, and outsourced semiconductor assembly and test partners.

• Provide package-design support and material-selection guidance to enable high-yielding, reliable, and cost-effective products.
• Develop and introduce new packaging technologies while supporting existing and legacy products.
• Collaborate with cross-functional teams to confirm adherence to design and technology rules and to define technology choices, timelines, milestones, and deliverables for new product launches.
• Lead end-to-end product readiness and the transition from development to production release, coordinating Design, Process, Test, Operations, and Module teams to meet quality, performance, and schedule objectives.
• Work with Skyworks’ internal assembly operation in Mexicali and external OSAT partners across Asia to support assembly-site selection, qualification, and execution.
• Lead product-readiness reviews covering technology, capability, capacity, and cost for each product release.
• Conduct design, process, and technology risk assessments and coordinate reliability activities throughout technology development, NPI, and ramp-up to support Cpk and yield targets.
• Identify risks and challenges in the NPI process and develop practical mitigation plans.
• Collaborate openly with cross-functional teams to manage projects, resolve technical and operational problems, and address critical issues.
• Prepare clear status reports and executive-level updates on product readiness, risks, decisions, and recovery actions.

• Bachelor's degree in Mechanical Engineering or a related engineering discipline, with 10+ years of relevant semiconductor packaging experience.
• Strong experience in new product introduction, package engineering, and package design for SOIC, QFN, lead-frame, LGA, BGA, and WLCSP semiconductor assemblies.
• Hands-on knowledge of semiconductor packaging assembly processes, including solder attach, die attach, wire bonding, overmolding, material curing, and BGA assembly.
• Experience applying relevant JEDEC, IATF, and AEC requirements to IC packaging and qualification.
• Strong knowledge of electronic packaging technologies, structures, materials, and processes, including EDS, die-stacking, SiP, MCM, WLCSP, and dual-sided packages.
• Experience with IC package modeling and simulation and with package-related failure analysis.
• Strong…