AI-First Hardware TPM — Lead Silicon Photonics Tapeout
Listed on 2026-10-17
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Engineering
Hardware Engineer
Neurophos, Inc. is seeking a seasoned TPM to own the EIC program, spanning architecture through tapeout and production readiness in Austin. You will integrate RTL, DV, analog/mixed-signal, and packaging with a strong AI-assisted workflow.
You will lead cross-functional teams, partner with foundries and OSAT, and drive risk management and schedule discipline in a fast-moving startup. Ideal candidates bring deep silicon program experience and startup mindset.
We would love to welcome a new AI-First Hardware TPM — Lead Silicon Photonics Tapeout to our team in Austin, TX, United States.
Join Neurophos, Inc. and contribute to our ongoing work.
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This posting is for the AI-First Hardware TPM — Lead Silicon Photonics Tapeout role at Neurophos, Inc., based in Austin, TX, United States.
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