AI-Driven Packaging Design Engineer; .5D/3D
Listed on 2026-10-17
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Engineering
Packaging Engineer, Product Engineer
Advanced Micro Devices, Inc. in Austin, Texas is seeking a Package Design Engineer to lead end-to-end package design for complex products, leveraging AI-enhanced design techniques and automation.
The role requires strong ownership, collaboration across SI/PI, mechanical, and SOC teams, and the ability to deliver high-quality designs under fast-paced deadlines. The successful candidate will advance AMD’s packaging methodologies, drive efficiency, and contribute to 2.5D/3D interposer designs,
We are seeking a motivated AI-Driven Packaging Design Engineer (2.5D/3D) to join Advanced Micro Devices, Inc. in Austin, TX, United States.
We appreciate your interest in this position.
Join Advanced Micro Devices, Inc. and contribute to our ongoing work.
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This posting is for the AI-Driven Packaging Design Engineer (2.5D/3D) role at Advanced Micro Devices, Inc., based in Austin, TX, United States.
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