Senior Thermal & Mechanical Packaging Engineer; Data Center
Listed on 2026-10-17
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Engineering
Mechanical Engineer, Packaging Engineer
Annapurna Labs (U.S.) Inc., part of Amazon Web Services, is seeking a Sr. Thermal & Mechanical Packaging Engineer in Austin, TX.
You will design and build packaging systems for the world's largest computing infrastructure, from circuit-level concepts to high-volume manufacturing. You will optimize thermal and mechanical solutions to meet performance, cost, and reliability targets, work with cross-functional teams, and validate designs with CFD/FEA tools and lab experiments.
Step into the Senior Thermal & Mechanical Packaging Engineer (Data Center) role at Amazon Web Services (AWS) in Austin, TX, United States and grow with us.
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