Packaging Systems Architect: Multi-Physics Data Center
Listed on 2026-10-17
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Engineering
Systems Engineer -
IT/Tech
Systems Engineer, Data Scientist
Advanced Micro Devices (AMD) in Austin, TX seeks a Package-centric Mechanical Modeling Architect to define and drive next-generation packaging-platform architectures. You will develop, validate, and apply mechanical and multi-physics models guiding architecture across package, board, and cooling solutions for data center and HPC systems.
The role requires ownership of modeling rigor, collaboration across silicon, package, board, and manufacturing teams, and influence on product roadmaps with a
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Multi-Physics for Data Center role at Advanced Micro Devices?
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This posting is for the Packaging Systems Architect:
Multi-Physics for Data Center role at Advanced Micro Devices, based in Austin, TX, United States.
We are looking to fill the Packaging Systems Architect:
Multi-Physics for Data Center position at Advanced Micro Devices in Austin, TX, United States.
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