Integration Engineer

ORCA Computing is developing an ultra-low loss integrated photonics platform for photonic quantum computers. Packaged devices will be deployed in real-world systems and will underpin our longer-term large-scale quantum computing architectures.

ORCA Computing is seeking a Photonic Integration Engineer to combine hands-on photonic component design with ownership of our packaging strategy. This role contributes to the design and optimization of ultra-low-loss components and PIC layouts, while owning packaging specifications, vendor relationships, and the fiber attach, wire bonding, and driver integration processes that get packaged devices to spec.

• Own packaging strategy and specifications, including fiber attach, wire bonding, and RF/driver integration
• Manage relationships and specifications with external vendors from development to volume production
• Maintain state of the art fiber-PIC coupling performance from the lab to packaged deployed devices
• Contribute to the design and optimization of ultra-low-loss passive photonic components and electro-optic (EO) modulators
• Develop and refine scalable, repeatable packaging processes
• Analyze characterization data and iterate both device- and package-level performance
• Maintain thorough documentation

• Significant industry experience in photonic or optoelectronic device packaging, including fiber attach
• Working knowledge of thermal management and RF/driver integration considerations for packaged photonic devices
• Working familiarity with photonic component design and simulation tools such as Lumerical MODE and FDTD
• Familiarity with PIC fabrication processes and constraints
• Must be based in Austin, TX, with hybrid work flexibility

• Master’s or PhD in Photonics, Physics, Electrical Engineering, or a related field
• Hands-on experience with Si photonics
• Familiarity with high-speed RF packaging and signal integrity considerations
• Background in quantum photonics or quantum optics