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Hardware Engineer

Job in Austin, Travis County, Texas, 78716, USA
Listing for: NUVACORE
Full Time position
Listed on 2026-10-19
Job specializations:
  • Engineering
    Hardware Engineer, Systems Engineer, Electrical Engineering, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 140000 - 250000 USD Yearly USD 140000.00 250000.00 YEAR
Job Description & How to Apply Below

Nuvacore is building a ground-up high performance, low-power CPU for next generation compute workloads. We are seeking a highly skilled and motivated Hardware Board Design Engineer to drive the architecture, design, and development of next generation, high performance, and energy efficient CPU server solutions for data center applications. In this role, you will be responsible for the end to end hardware development life cycle, from initial concept and feasibility studies to schematic capture, PCB layout oversight, component selection, and laboratory brings up.

You will collaborate closely with cross functional teams—including Package Design, Signal Power Integrity (SI PI), Thermal Mechanical Engineering, and Software Firmware to deliver robust, scalable, and cutting edge system platform hardware.

ROLE
  • Board Level Architecture & Design: Lead the design and development of complex, multi layer, high density interconnect (HDI) server motherboards, baseboards, and riser cards optimized for data center workloads.
  • Schematic Capture & Component Selection: Ownership of schematic entry, creation of complex hierarchical designs, and rigorous component selection prioritizing power efficiency, thermal performance, and long term reliability.
  • Layout

    Collaboration:

    Work hand in hand with PCB layout engineers to define board stack ups, routing constraints, component placement, and shielding strategies.
  • Cross Functional Alignment: Collaborate tightly with the Silicon, Package Design, and SI PI teams to implement optimal co design methodologies for high speed interfaces (e.g PCIe Gen6 Gen7, DDR5 LPDDR6, CXL) and robust power delivery networks (PDN).
  • Power & Thermal Management: Design highly efficient, high current power delivery paths (VRMs, multiphase buck converters) capable of supporting ultra high power CPUs while meeting strict data center energy efficiency metrics.
  • Bring up, Validation & Debug: Lead the hands on hardware bring up, debugging, and validation of prototype boards in the lab using high speed oscilloscopes, logic analyzers, and specialized test equipment.
  • Manufacturing Support: Generate comprehensive fabrication and assembly documentation (Gerbers, BOMs, ODB++) Partner with fabrication houses and EMS partners to resolve DFM DFA DFT issues and ensure smooth mass production transitions.
REQUIREMENTS — MUST HAVE
  • Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
  • Experience: 5+ years of professional experience in high speed hardware board design, ideally focused on enterprise servers, data center hardware, or complex computing platforms.
  • EDA Tools: High proficiency in industry standard schematic capture and PCB layout tools (e.g Cadence Allegro, Concept HDL, OrCAD, or Altium Designer).
  • High Speed Design Knowledge: Direct experience designing with high speed serial parallel interfaces (such as PCIe, DDR LPDDR, or USB) and understanding basic SI PI constraints.
  • Power Delivery: Proven experience with board level power distribution design, DC DC converters, and multi phase VRMs supporting high current rails.
  • Lab

    Skills:

    Strong hands on laboratory experience with hardware debugging, rework, and using diagnostic equipment (DMMs scopes, network analyzers).
REQUIREMENTS — NICE TO HAVE
  • Education: Master’s degree in Electrical Engineering or Computer Engineering.
  • Advanced Data Center

    Experience:

    10+ years deep understanding of data center server architectures, OCP (Open Compute Project) standards, and system topologies (e CPU sockets, high speed riser configurations, and BMC sub systems).
  • Silicon Package Board Co Design: Familiarity with the interplay between advanced semiconductor packaging (e chiplets, 2 5D bridges) and high density PCB implementation.
  • Simulation & Modeling: Familiarity with SI PI and thermal simulation concepts using tools such as Ansys (SIwave HFSS), Cadence Sigrity, or Hyper Lynx to guide early stage design constraints.
  • Manufacturing Integration: Strong background in optimizing layouts for high volume manufacturing, minimizing layer counts while maintaining performance, and handling DFX (Design for Manufacturing Assembly Test) validation.
  • Self Driven & Collaborative: Excellent communication and cross functional collaboration skills, with the ability to thrive in a fast paced startup like environment.

$140,000 - $250,000 a year

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