Director – Advanced Packaging; Panel-Scale Technologies

Position: Director – Advanced Packaging (Panel-Scale Technologies)
ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward.

Join us and, together, we’ll advance your career.

The Role We are seeking an advanced packaging technology leader to drive panel-scale packaging technology for next-generation data center and AI accelerator products. As a fabless company, AMD delivers packaging innovation through its ecosystem partners. In this role, you will set the panel-scale technology direction and lead through foundry, OSAT, substrate, materials, and equipment partners to define and deliver the materials, processes, design rules, and Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines that AMD products require.

You will own panel-scale technology readiness from concept through qualification and high-volume manufacturing, aligning partner roadmaps with AMD needs, holding partners accountable to technical and schedule commitments, and leading cross-functional AMD teams across geographies. You will communicate progress and risks to executive leadership and drive joint resolution of yield, reliability, and manufacturability challenges.

The Person You have a proven track record of driving semiconductor technology development through external partners, ideally in advanced packaging for data center products. You lead through influence, building trusted, technically deep relationships with suppliers and foundries while setting clear requirements and driving execution. You are an excellent communicator who can convey complex technical findings and recommendations to partners, colleagues, and AMD executive leadership.

Key Responsibilities Define the panel-scale packaging technology roadmap for data center and AI products and align partner technology roadmaps to it.

Lead panel-scale technology development with partners—including panel-level fan-out, large-format RDL(re-distribution layer) and interposers, and panel-scale die bonding—from concept through full qualification.

Set technical requirements and guide partners in materials selection and process definition, ensuring solutions meet AMD performance, reliability, and cost targets.

Work with partners to establish design rules and DFM/DFY guidelines, using jointly defined test vehicles to validate capability.

Drive partner equipment and infrastructure readiness for panel-format manufacturing.

Engage partners to resolve large-panel challenges including warpage, dimensional stability, overlay and alignment, and large-area uniformity.

Establish yield and reliability targets, monitor partner data, and drive joint improvement plans through high-volume ramp.

Lead cross-functional AMD teams across geographies and provide executive-level updates on partner progress, risks, and decisions.

Preferred Experience Semiconductor technology development.

Leading technology development through foundries, OSATs, substrate suppliers, materials suppliers, and equipment vendors.

Deep knowledge of 2.5D and 3D packaging, with experience in panel-level packaging or large-format substrates.

Experience in wafer-level assembly processes such as fan-out, RDL fabrication, bumping, chip-on-wafer assembly, molding, temporary bonding/debonding, and wafer thinning.

Experience with die bonding technologies, including mass reflow, thermocompression bonding (TCB), and hybrid bonding.

Familiarity with emerging panel…