Packaging Systems Architect: Multi-Physics Data Center

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THE ROLE:

In this role, you will serve as a Package-centric Mechanical Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). You will develop, validate, and apply mechanical and multi-physics models to guide package/board-level architecture, technology selection and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions.

THE PERSON:

The ideal candidate is a self-directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for advanced package architecture & design decisions and influence product and platform roadmaps for data center and high-performance computing systems.

KEY RESPONSIBILITIES:

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies, including materials, stack-ups, high-layer-count designs, stiffness control and SMT & manufacturability considerations.
• Develop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
• Partner with manufacturing and operations to define, optimize, and scale SMT and mechanical assembly processes, including component attach, solder joint reliability, assembly tolerances, yield, and connector strategies.
• Engage with PCB suppliers, EMS partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
• Define targets and strategic direction for mechanical and package technology development, assess technology readiness, and influence product roadmaps.
• Serve as a mechanical & multi-physics subject-matter expert for package and board-level architectures with a primary focus on data center platforms.

PREFERRED EXPERIENCE:

• Demonstrated experience owning model-based architecture & design decisions, supported by board-, package-, and system-level mechanical and multi-physics modeling, characterization and validation.
• Strong background in advanced PCB technologies, including materials, high-layer-count designs, warpage and stiffness control, and assembly constraints.
• Solid foundation in Mechanics, Fracture, Materials, Design & FEA with the ability to apply first-principles understanding to multi-physics package-and-system-level design & assembly trade-offs.
• Experience influencing SMT processes, connectors, and mechanical assembly strategies from an architecture and modeling perspective.
• Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
• Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform…