Physical Failure Analysis Engineer

In this role, you will deliver professional failure analysis and characterization solutions across a wide array of next-generation materials, silicon devices, and advanced products, and collaborate with multi-functional teams to launch the world's most premiere products.

At Apple, we work every single day to craft products that enrich people’s lives. Do you love working on challenges that no one has solved yet? Do you like changing the game? We have an opportunity for a forward-thinking and especially motivated Sample Prep Failure Analysis Engineer! As a member of our dynamic group, you will have the rare and great opportunity to work on upcoming products that will delight and encourage millions of Apple’s customers every day!

In this role, you will partner directly with cross-functional teams to evaluate incoming failure analysis requests, define appropriate analytical strategies, and perform hands-on physical preparation for root-cause isolation. You will be responsible for preparing silicon, packaged components, and multi-layer boards (MLBs) using advanced CNC mechanical polishers, chemical and dry etching, and precision cross-sectioning techniques. You will provide samples optimized for high-resolution imaging, micro-probing, and nano-probing, conveying analytical findings to engineering teams and upper management.

Your expert craftsmanship, creativity, and analytical rigor will be indispensable in guaranteeing our beloved Apple products are delivered to the world on time.

• Collaborate with internal Apple teams to understand FA requests, assess failure modes, and determine the optimal FA preparation methodology
• Perform daily hands-on sample preparation, including precision mechanical cross-sectioning, encapsulation, parallel lapping, and polishing for a wide variety of materials, packaged die, and multi-layer boards (MLBs)
• Prepare silicon and device samples optimized for optical microscopy, SEM-based inspection, micro-probing, and nano-probing
• Develop and optimize new chemical- and physical-based delayering and de-processing methods for advanced technology nodes
• Execute decapsulation, wet chemical etching, and dry reactive/plasma etching workflows for targeted defect isolation
• Develop and refine automated recipes on CNC-based polishers for iterative planar polishing and parallel de-processing
• Conduct optical inspection and screening using advanced optical microscopy, perceiving complex device structures in three dimensions to target regions of interest
• Maintain rigorous traceability, custody, and documentation of customer and prototype samples throughout the failure analysis lifecycle
• Prioritize and execute multiple sample preparation requests concurrently to meet aggressive project deadlines in an unattended and self-directed manner
• Prepare clear, concise technical reports and documentation (e.g., Keynote or equivalent) summarizing preparation methodologies, structural observations, and findings
• Evaluate, maintain, and qualify new sample preparation equipment, consumables, and laboratory techniques

• B.S. with 4+ years, A.A. with 6+ years, or High School Diploma with 8+ years of relevant hands-on FA sample prep experience.
• Deep understanding of fundamental failure analysis methodologies, defect isolation workflows, and sample preparation principles
• Extensive hands-on experience with mechanical cross-sectioning, encapsulation, and iterative planar polishing
• Extensive hands-on experience with CNC-based polishers, decapsulation, parallel lapping of MLBs, and packaged die
• Hands-on proficiency with wet and dry etch methods for sample de-processing and material removal
• Proficiency in optical microscopy and basic understanding of mechanical and…