R&D Scientist: -Gen HPC Dielectric Materials
Listed on 2026-10-16
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Research/Development
Research Scientist -
Engineering
Materials Engineering, Research Scientist
Avient Corporation seeks an accomplished R&D Scientist to lead innovation in thermoplastic materials for HPC, AI infrastructure, and hyperscale data centers. You will drive advanced dielectric materials development for high-speed connectors and semiconductor packaging, shaping next-generation computing architectures.
The role demands deep expertise in materials science, electrical performance, and advanced characterization, with DOE and IP development experience to accelerate commercialization
Join us at Avient Corporation as our next R&D Scientist:
Next-Gen HPC Dielectric Materials in Avon Lake, OH, United States.
Learn more about the R&D Scientist:
Next-Gen HPC Dielectric Materials role in the description above.
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This posting is for the R&D Scientist:
Next-Gen HPC Dielectric Materials role at Avient Corporation, based in Avon Lake, OH, United States.
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