Postdoc: Metrology & Bonding Advanced Packaging
Listed on 2026-10-07
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Research/Development
Research Scientist
Johns Hopkins University is seeking a PREP Research Associate in Baltimore to advance measurement science for semiconductor advanced packaging. This position will involve designing tests for evaluating bond quality and requires a PhD in a relevant field.
The ideal candidate will have experience with wafer bonding processes and proficiency in finite element modeling. Strong communication skills and the ability to work in a team are essential for success in this role.
The following role is for a Postdoc:
Metrology & Bonding for Advanced Packaging with Johns Hopkins University.
Step into the Postdoc:
Metrology & Bonding for Advanced Packaging role at Johns Hopkins University in Baltimore, MD, United States and grow with us.
Please review the full job details above before applying.
If your experience matches this role, we encourage you to apply.
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