Director of Packaging – GaN Power & Innovation
Listed on 2026-09-18
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Engineering
Packaging Engineer, Systems Engineer
Cambridge GaN Devices Ltd. in Cambridge, UK, is seeking a Director of Packaging to lead the expanding packaging team and translate strategy into actionable priorities.
This senior, hands-on role requires deep expertise in semiconductor packaging, multi-physics simulations, and global supplier management, with autonomy and strategic influence across functions. The successful candidate will drive innovation for high-density GaN power packages while mentoring engineers and collaborating with
The Director of Packaging – GaN Power & Innovation position in the Management & Operations, Engineering field is open for applications.
The position is based in United Kingdom.
This opportunity is part of our work in Management & Operations, Engineering.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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