Principal Member of Technical Staff – Wafer Bonding & Assembly

Principal Member of Technical Staff –Wafer Bonding & Assembly What you will do

As a Principal Member of Staffyouhaveobtaineda broad,in-depthand hands-on knowledge ofwafer bonding & advanced packagingprocesses inthe semiconductor industry.

Your main responsibilities will include:

• Using your expertise, you will support the team membersduringtechnicalandengineeringchallenges.
• You willcoach and develop the teamto bring the processes we supporttoward a highermaturitylevel.
• Using your industry background, you support the team with setting up efficient POR’s&standardizingourway of working.
• You stay abreast of new development sand technologies in the field ofwafer bonding and advanced packaging, and youare responsible fordistributingthisknowledge to the relevant stakeholders.
• You translate the needs of thearea, the FABand imecintoroadmaps.
• You build bridges to other groups and departments,andyou are the scientificspokesperson for the groupand departmentinvariousfora.
• You provide strategic technical leadership and ensure systematic follow-up on long-term initiatives, including internal improvement projects, customer collaborations, and market exploration for tool acquisitions.
• Occasionallyyoupublish your results in high-impact journals,conference sand technical seminars

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will define the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

• You have a PhD in Applied Sciences, Chemistry, Physics, Material Engineeringor equivalent through experience,with at least
  10-yearworkexperience in the semiconductor industryrelated towafer bonding & advanced packaging.
• You have a strong technical, hands-on& scientificbackground.
• You have a good understandingofwafer bonding & advanced packagingchallenges in semiconductor technologycombined with solid knowledge of device integration and the different process steps to build these devices
• You have experience working with internal and external customers including leading edge semiconductor equipment manufacturers.
• You are a team player and flexible in accommodating changing priorities to support business needs.
• Youare self-motivated,responsible and are willing to take ownership.
• You feel at home and know how to integrate into a multicultural environment
• You have outstanding English communication skills to work successfully in an international dynamic team environment.

IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such assearch firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred bythe Agency freeof charge. IMEC will not pay a fee toany Agency that does not have a prior written agreement with IMEC, validated byits HR department, in place regarding a specific job opening and allowing tosubmit resumes.