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Sr. Thermal Scientist​/Engineer, Product Integrity, Hardware - Product Integrity

Job in Bellevue, King County, Washington, 98009, USA
Listing for: Amazon
Full Time position
Listed on 2025-12-25
Job specializations:
  • Engineering
    Engineering Design & Technologists, Electronics Engineer, Systems Engineer, Research Scientist
Salary/Wage Range or Industry Benchmark: 150400 - 260000 USD Yearly USD 150400.00 260000.00 YEAR
Job Description & How to Apply Below

Sr. Thermal Scientist/Engineer, Product Integrity, Hardware - Product Integrity

Job  |  Services LLC

You will be working with a unique and gifted team developing exciting products for consumers. The team is a multidisciplinary group of engineers and scientists engaged in a fast‑paced mission to deliver new products. The team faces a challenging task of balancing cost, schedule, and performance requirements. You should be comfortable collaborating in a fast‑paced and often uncertain environment, and contributing to innovative solutions while demonstrating leadership, technical competence, and meticulousness.

Key deliverables include development of thermal solutions, concept design, feature development, product architecture, and system validation through to manufacturing release. You will support creative developments through application of analysis and testing of complex electronic assemblies using advanced simulation and experimentation tools and techniques.

Key Responsibilities
  • Evaluate and optimize thermal solution requirements of consumer electronic products
  • Use simulation tools like Star‑CCM+ or Flo Therm XT/EFD for analysis and design of products
  • Validate design modifications for thermal concerns using simulation and actual prototypes
  • Establish temperature thresholds for user comfort level and component reliability
  • Apply knowledge of materials and heat spreaders to resolve thermal issues
  • Use programming languages like Python and MATLAB for analytical, statistical analysis, and automation
  • Collaborate with device team to optimize design parameters of enclosures and structural parts to deliver project objectives
  • Design and execute tests using statistical tools to validate models, identify risks, and assess design margins
  • Create and present analytical and experimental results
  • Develop and apply design guidelines based on project learnings
About the Team

Amazon Lab
126 is an inventive research and development company that designs and engineers high‑profile consumer electronics. Lab
126 began in 2004 as a subsidiary of , Inc., originally creating the best‑selling Kindle family of products. Since then, we have produced devices like Fire tablets, Fire TV, and Amazon Echo.

Basic Qualifications
  • PhD or Master's degree and 7+ years of industry or academic research experience
  • 7+ years of experience using CFD thermal simulation software in consumer electronics
  • 7+ years of experience using Star‑CCM+, Flo Therm XT/EFD or comparable tool
  • Experience using geometric tolerances and statistical tolerance analysis techniques
  • Use of programming languages like Python and MATLAB for analytical, statistical analysis, and automation
  • Experience in manufacturing processes such as injection molding, sheet metal forming, die casting, Design for Manufacturability (DFM), and Design for Assembly (DFA)
Preferred Qualifications
  • Experience in mentoring, leading, and coaching
  • Demonstrated design experience with consumer electronics enclosure materials
  • PhD in mechanical engineering or related field
  • Creo Systems knowledge, Experience with MATLAB or other engineering tools for modeling systems
  • Demonstrated experience with statistical analysis tools like JMP and Relia Soft
  • This position may require international travel
EEO Statement

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Compensation

Base pay ranges from $150,400/year in our lowest geographic market to $260,000/year in our highest geographic market. Equity, sign‑on payments, and other compensation may be provided as part of a total package.

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