Wire Bonding Specialist

Berkeley Lab is hiring a Wire Bonding Specialist to support precision microelectronics assembly. This role is key to fabricating advanced electronic systems for scientific detectors, sensors, and instrumentation. You’ll perform precision wire bonding on hybrid microcircuits, semiconductors, and microelectronic devices, collaborating with engineers and scientists in cleanroom and lab environments. The position supports both R&D and production projects—an exciting chance to contribute to world‑class scientific research.

What You Will Do:

• Operate and maintain gold and aluminum wire bonders.
• Perform wedge and ball bonding on hybrid modules, power boards, and sensors.
• Set up and optimize bonding parameters for various materials and applications.
• Ensure alignment and bond integrity per engineering specs.
• Conduct visual and metrology inspections under a microscope.
• Verify bond quality using mechanical pull/shear tests.
• Troubleshoot bonding defects and implement corrective actions.
• Report on production status, yield, and quality metrics.
• Follow detailed drawings, schematics, and documentation for precise assembly.
• Support prototype and production assembly of microelectronic devices.
• Maintain accurate records and support process improvements.
• Collaborate with engineers, scientists, and technologists on integration and testing.

What is

Required:

• 4–6 years of wire bonding experience or equivalent education/experience.
• Proficient with manual/automated wire bonders (e.g., West‑Bond, K&S, Hesse).
• Skilled in wedge and ball bonding techniques and inspection methods.
• Experienced in visual/mechanical inspection using microscopes and test tools (pull/shear testers).
• Able to interpret engineering drawings, bond diagrams, and assembly docs.
• Strong hand‑eye coordination and attention to detail for microscope work.
• Familiar with cleanroom environments and Electrostatic Discharge (ESD) safe practices.
• Solid understanding of electronics fabrication and quality standards.
• Proficient with trade tools, measurements, and basic calculations.
• Can read schematics, sketches, and component layouts.
• Color vision adequate for identifying wiring and safety indicators.
• Physically able to climb stairs and lift up to 50 lbs (23 kg).
• Good communication skills; able to work independently or on a team.
• 6+ years of wire bonding experience or equivalent education/experience.

Desired

Qualifications:

• Experience with Hesse BJ815, BJ820, and BJ855 wire bonders is a plus.
• Knowledge of ESD protocols and cleanroom procedures.
• Comfortable working under a microscope for extended periods.
• Associate degree, trade school, or equivalent training in wire bonding required.
• Familiar with electronics documentation and basic PC applications (Google Workspace, databases, MS Office).
• Python scripting is a plus.
• Skilled in developing technical procedures and training materials.

Notes:

• This is a full‑time career appointment, non‑exempt (hourly paid) from overtime pay.
• This position is represented by a union for collective bargaining purposes.
• Salary will be determined based on range by collective bargaining agreement.
• The hourly range for the Wire Bonding Specialist Level 3 position is $41.77 - $60.55. The hourly rate for this position will be commensurate with the final candidate’s qualifications and experience, including skills, knowledge, relevant education, certifications, plus also aligned with the internal peer group.
• The hourly range for the Wire Bonding Specialist Level 4 position is $48.02 - $69.63. The hourly rate for this position will be commensurate with the final candidate’s qualifications and experience, including skills, knowledge, relevant education, certifications, plus also aligned with the internal peer group.
• This position is subject to a background check. Any convictions will be evaluated to determine if they directly relate to the responsibilities and requirements of the position. Having a conviction history will not automatically disqualify an applicant from being considered for employment.
• Work will be primarily performed at:
  Lawrence Berkeley National Lab, 1 Cyclotron Road, Berkeley, CA.

Want to learn more about working at Berkeley Lab? Please visit: careers.lbl.gov

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