Thermal Systems Architect — Advanced Packaging
Listed on 2026-11-04
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Engineering
Systems Engineer, Packaging Engineer
Boston Materials is seeking a highly motivated Applications Engineer to serve as the primary technical partner for customers evaluating our high-performance thermal interface material (TIM). You will lead early- to mid-stage customer interactions, translating requirements into actionable technical work and ensuring data, samples, and support for successful integration.
This role offers close collaboration with hyperscalers, ODMs, and OSATs to influence adoption of cutting-edge thermal solutions
For the Thermal Systems Architect — Advanced Packaging position at Boston Materials, we are reviewing applications now.
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We would love to welcome a new Thermal Systems Architect — Advanced Packaging to our team in Billerica, MA, United States.
Step into the Thermal Systems Architect — Advanced Packaging role at Boston Materials in Billerica, MA, United States and grow with us.
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