Senior Electroplating Process Engineer

• Salary range: $90,000 – $155,000 per year + equity

Copper doesn't grow on silicon by itself. You'll invent the chemistry that makes it happen, and make sure it lasts.

CHIPADD is based in Binghamton, NY, close to the original birthplace of IBM, and we have leadership based in Silicon Valley as well. Our culture runs on curiosity, execution and a deep commitment to the mission.

• Develop new electrochemical processing methods. Knowledge of electroplating, electroless deposition and selective or patterned plating a must.
• Develop and optimize plating and electroless chemistries, including bath composition, additives (accelerators, suppressors and levelers), pH, temperature, agitation and current waveforms such as DC, pulse and pulse-reverse
• Engineer the full wet process flow, from surface preparation, seed and barrier layers and activation through deposition, rinse, dry and anneal, while managing adhesion, film stress and thermal budget on the silicon
• Set up bath analysis and control (titration, CVS, Hull cell, XRF or ICP) and define replenishment, dummy plating and bath-life rules
• Plan and run designs of experiments (DOEs) to map process windows and correlate parameters with thickness uniformity, grain structure, purity, voiding, adhesion and surface finish
• Characterize deposits and interfaces with optical microscopy, SEM/EDS, cross-sectioning, XRD, profilometry, and adhesion and stress testing
• Evaluate corrosion and galvanic behavior of our copper features, metallization stacks and finishes in data center coolants, using electrochemical methods (potentiodynamic polarization, EIS, Tafel analysis) and long-duration immersion and flow testing, and develop protective finishes or inhibitor strategies where needed
• Own environmental, health and safety (EHS) for our wet chemistry: chemical selection and approval, SDS management, storage and segregation, PPE, fume hood and wet bench requirements, spill response, waste handling and disposal, and compliance with OSHA, EPA and New York State rules
• Design racks, fixtures, masks and plating cell components in CAD, and 3D print or source them so experiments move fast; help specify plating tools and wet benches as we scale
• Write SOPs, work instructions and process control plans so every bath and every run is repeatable, and transfer processes to manufacturing and partners

• MS or PhD in Chemical Engineering, Materials Science, Chemistry or a related field, ideally with a focus on electrochemistry
• 5–7 years of hands‑on electroplating and electrochemical process development, ideally in semiconductor, advanced packaging, PCB or MEMS manufacturing
• Deep experience with electroplating and electroless deposition (copper strongly preferred; nickel, gold, palladium or tin also valuable), including bath chemistry, additive behavior and process control
• Working knowledge of semiconductor manufacturing processes such as metallization, seed and barrier deposition, lithography and patterning, wet cleans and CMP
• Solid grounding in corrosion fundamentals: thermodynamics and kinetics, Pourbaix diagrams, galvanic coupling, pitting and crevice corrosion, and how to test for them
• Proven ability to run a safe chemical lab, including hazard assessments, chemical hygiene plans, waste management and regulatory compliance
• Basic mechanical skills: CAD (Solid Works, Fusion 360 or similar), 3D printing, and working knowledge of engineering materials and chemical compatibility
• Experience characterizing deposits and interfaces (SEM/EDS, cross‑sections, XRF, adhesion and stress measurements)
• Strong experimental and statistical mindset, including DOE and SPC (JMP, Minitab or Python)

• Experience with TSV, copper pillar, RDL or damascene plating
• Experience…