UTP Wafer Process Engineering Technician IV - B Shift

Job Title:

UTP Wafer Process Engineering Technician IV – B Shift

Posting

Start Date:

10/19/26

Requisition

As a Wafer Process Engineering Technician, you play a critical role in supporting Seagate’s thin‑film head manufacturing. You will partner closely with process and sustaining engineers to control processes, evaluate tool performance, execute data‑driven troubleshooting, and ensure the highest quality of recording head wafers. This position requires strong analytical skills, comfort working with data, and the ability to apply structured problem‑solving in a fast‑paced production environment.

This role supports a complex, high‑reliability operating environment where sustained mental focus, continuous learning, and sound judgment are required throughout extended shifts.

As a UTP Wafer Process Engineering Technician, you will provide specialized technical and sustaining support for UTP production and RD processing in Seagate’s thin‑film head manufacturing environment. You will support wafer flow, GaAs wafer processing and qualification, manual RD operations, and first‑line troubleshooting of UTP equipment and processes.

Working with Process, Sustaining, and RD Engineering, Operations, Materials, and Maintenance, you will coordinate priorities, maintain production flow, respond to abnormal conditions, and interpret process and equipment data. As an Engineering Specialist IV, you will serve as a shift resource—independently assessing unfamiliar situations, managing product and equipment risk, supporting other technicians, and escalating when additional expertise is required.

This high‑reliability role requires sustained focus, continuous learning, sound technical judgment, and clear communication through Microsoft Teams, Outlook, and shift passdowns.

Able to work B-Shift, Mon-Wed, and every other Thursday, 6:30PM-6:30AM

• Manage incoming and outgoing UTP production WIP, source wafers, utilization, and priorities based on time at step, production needs, and special requests; coordinate schedules and concerns across RD Admins, Operations, Engineering, and Materials.
• Manage GaAs wafer qualification, including yield inspection review, rework, custom transfer maps, and specialized handling.
• Evaluate qualification and process stability using SPC charts, distributions, trends, correlations, historical baselines, and quantitative reasoning; distinguish normal variation from assignable causes and assess product or process risk.
• Perform manual overnight RD runs, wafer and optical alignment, safe abort and wafer removal, Stamp and Height Sensor calibrations, and custom handling following interruptions.
• Balance UTP assignments with broader factory priorities and support other manufacturing areas when needed.

• Independently perform first‑line troubleshooting for UTP processes, equipment behavior, software alarms, and ambiguous manufacturing issues using structured problem‑solving.
• Analyze tool logs, KPIV and wafer data, SPC results, and historical trends to differentiate equipment-, process-, material-, and system-driven causes and determine next steps.
• Review MWE configurations, consumables, and chemical bath compositions; resolve applicable alarms and coordinate Maintenance support when required.
• Apply technical judgment when documentation does not address a condition, considering personnel, product, equipment, and process risk; elevate with clear evidence, actions taken, and required follow‑up.
• Support Engineering trials, experiments, qualifications, special processing, software or process testing, and manual runs; monitor processes, make in‑scope adjustments, and document…