Principal Signal Integrity Engineer, Pathfinding

Principal Signal Integrity Engineer – Pathfinding

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron’s Interface Pathfinding team serves as a bridge between corporate strategy and the engineering teams through forward-looking investigation and development of energy‑efficient bandwidth solutions in support of sustained technology leadership. As such, all members of the team are expected to proactively identify and evaluate opportunities for, and drive, performance scaling through innovative circuit, signaling, packaging and interconnect solutions with a 3‑5 year outlook, and to develop a robust intellectual property portfolio around the same.

These objectives are realized through an environment of diligent, continuous learning.

• Generating and / or validating interconnect models employed by the team
• Evaluating forward‑looking substrate technologies and providing strategic direction
• Providing signal integrity analysis during feasibility studies and I/O + channel co‑optimization, and driving such activities when they are handled by a supporting organization
• Driving progressive design rules to enable package and system performance
• Helping establish forward‑looking link budgeting and robust sim‑to‑silicon correlation methods

The candidate will be expected to engage across multiple disciplines and organizations including Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration.

• PhD with 10 years of industry experience or MSEE with 15 years of industry experience
• Extensive experience applying electromagnetic / transmission line theory to signal / power integrity analysis of differential and single‑ended interface technologies
• Extensive experience with time and frequency domain simulation tools (ADS, HSPICE, SPECTRE, etc.)
• Deep understanding of, and experience driving, electromagnetic field solvers (Q3D, SIWAVE, HFSS)
• Working knowledge of measurement methods and tools (Oscilloscopes, TDR, VNA, etc.)
• Basic understanding of memory I/O design
• Willingness to learn and apply AI to streamline modeling and simulation methodologies is a plus

• Pro‑active – candidate will be expected to identify gaps and opportunities and address them with minimal supervision.
• Visionary – candidate will be expected to think “outside‑the‑box” and yet offer innovative solutions within a set of practical constraints.
• Communicator – candidate should be able to clearly convey necessary details of complex issues and corresponding solutions in both written and verbal formats.
• Collaborator – candidate should be able to work synergistically within the larger pathfinding team.

Mid‑Senior level

Full‑time

Semiconductor Manufacturing