×
Register Here to Apply for Jobs or Post Jobs. X

Senior Thermal Simulation Engineer, 3D​/5D Packaging

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology, Inc.
Full Time position
Listed on 2026-01-02
Job specializations:
  • Engineering
    Systems Engineer
Salary/Wage Range or Industry Benchmark: 100000 - 125000 USD Yearly USD 100000.00 125000.00 YEAR
Job Description & How to Apply Below
Position: Senior Thermal Simulation Engineer, 3D/2.5D Packaging
A leading semiconductor company located in Boise,  seeking a Thermal Simulation Engineer to develop innovative packaging solutions. This role involves optimizing advanced memory technologies while collaborating with global teams. Candidates should have extensive experience in thermal analysis and relevant engineering tools. Benefits include comprehensive health plans and robust paid time-off programs.
#J-18808-Ljbffr
Position Requirements
10+ Years work experience
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)

Job Posting Language
Employment Category
Education (minimum level)
Filters
Education Level
Experience Level (years)
Posted in last:
Salary