Principal Engineer, IC Package Design & QA; Global
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-01-12
Listing for:
Micron Memory Malaysia Sdn Bhd
Full Time
position Listed on 2026-01-12
Job specializations:
-
Engineering
Job Description & How to Apply Below
A global leader in memory solutions is seeking a Quality Assurance Principal Engineer based in Boise, Idaho. In this role, you'll ensure the reliability of new IC package technology introductions and lead risk assessments. The ideal candidate will hold a Master's degree and have over 7 years of experience in semiconductor package design and manufacturing. Excellent analytical and communication skills are essential for this position.
Benefits include comprehensive health plans and generous paid time off.
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