DRAM Process Integration Engineer — R&D -Gen Memory
Listed on 2026-10-06
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Engineering
Process Engineer, Electronics Engineer, Materials Engineering, Mechanical Engineer -
Research/Development
Electronics Engineer
Micron Technology, Inc. is seeking a Process Integration Engineer for the DRAM R&D Memory Group. You will develop and integrate critical technology enabling future DRAM memory scaling, working with multiple teams to translate new module solutions into production.
Requirements include an MS or PhD in a relevant field, expertise in device physics and memory tech, and strong data analysis, DOE and statistics capabilities. The role emphasizes cross-functional collaboration and engineering leadership.
We are looking to fill the DRAM Process Integration Engineer — R&D for Next-Gen Memory position at Micron Technology, Inc. in Boise, , United States.
We are seeking a motivated DRAM Process Integration Engineer — R&D for Next-Gen Memory to join Micron Technology, Inc. in Boise, , United States.
Consider building your career as a DRAM Process Integration Engineer — R&D for Next-Gen Memory at Micron Technology, Inc.
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