Senior Process Development Lead, Advanced Packaging
Listed on 2026-10-06
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Engineering
Packaging Engineer
Micron Technology, Inc. in Boise, Idaho, is seeking an experienced organizational leader to drive methodology improvements and apply AI/advanced analytics to accelerate development of its most advanced memory packaging technologies, including HBM and 3DS DRAM.
You will influence internal roadmaps, partner with R&D, suppliers, and manufacturing across programs, guiding end‑to‑end execution and multi‑domain decisions.
This is a great opening to take on the Senior Process Development Lead, Advanced Packaging role at 1000 Micron Technology, Inc.
Our group is growing, and we are hiring a Senior Process Development Lead, Advanced Packaging in Boise, , United States.
This opening is for the Senior Process Development Lead, Advanced Packaging role at 1000 Micron Technology, Inc.
We are seeking a motivated Senior Process Development Lead, Advanced Packaging to join 1000 Micron Technology, Inc. in Boise, , United States.
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