Process Integration Engineer: .5D/3D Packaging & HBM
Listed on 2026-10-06
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Engineering
Process Engineer, Manufacturing Engineer, Packaging Engineer
Micron Technology, Inc. is seeking a Process Integration Engineer for Advanced Packaging to develop and integrate 2.5D/3D architectures, including HBM, and to drive reliability and performance improvements across cross-functional teams.
You will design experiments, qualify materials, and transfer new processes to manufacturing, while addressing wafer warpage and performance optimization in high-volume production environments.
The Process Integration Engineer: 2.5D/3D Packaging & HBM role at Micron Technology, Inc. is now open for applications in Boise, , United States.
The position is based in Boise, , United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 120..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Process Integration Engineer: 2.5D/3D Packaging & HBM role in the description above.
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