Equipment Dev Engineer, Advanced Packaging
Listed on 2026-10-07
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Engineering
Packaging Engineer, Process Engineer
Micron Technology, Inc. in Boise, Idaho, is seeking a Staff Equipment Development Engineer to drive FAOK wafer and die equipment development within the Advanced Technology Packaging Development team.
You will shepherd concepts from design through deployment, coordinating with process development, manufacturing, and vendors to ensure robust, scalable solutions. You will apply DOE, FMEA and data analysis to identify failure modes, optimize equipment maturity, and lead cost-reduction initiatives
This role, Staff Equipment Dev Engineer, Advanced Packaging at Micron Technology, Inc., could be your next move.
Our organisation is growing, and we are hiring a Staff Equipment Dev Engineer, Advanced Packaging in Boise, , United States.
This opportunity is for the Staff Equipment Dev Engineer, Advanced Packaging role at Micron Technology, Inc.
We are seeking a motivated Staff Equipment Dev Engineer, Advanced Packaging to join Micron Technology, Inc. in Boise, , United States.
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