DMTS Process Development Engineer — AI-Enabled Packaging
Listed on 2026-10-07
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Engineering
Packaging Engineer, AI Engineer (Applied/Software)
Micron Technology, Inc. is seeking an experienced organizational leader to guide methodology improvements, data-driven decision-making, and AI/advanced analytics to drive innovation in advanced packaging for memory products.
You will steer end-to-end technology execution across HBM, 3DS DRAM, and emerging 3D architectures, influencing internal roadmaps and external ecosystems. You will lead cross-functional programs, mentor engineers, and collaborate across teams to deliver high-impact packaging
We are currently recruiting a DMTS Process Development Engineer — AI-Enabled Packaging for our team in Boise, , United States.
Please review the full job details above before applying.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Boise, , United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 140..
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