CMP Process Engineer: AI-Driven Advanced Packaging
Listed on 2026-10-07
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Engineering
Process Engineer, Quality Engineering, Manufacturing Engineer
Micron Technology, Inc. is seeking a Staff Process Engineer in Advanced Packaging CMP to start up, develop, and optimize CMP processes.
The role focuses on improving product quality, yield, and reliability while reducing costs, with significant collaboration across regions and vendors. The candidate will diagnose and resolve assembly process issues using FMEA, 8D, and SPC/FDC methodologies, and contribute to strategic projects, technology advances, and IP generation.
Step into the Staff CMP Process Engineer: AI-Driven Advanced Packaging role at Micron Technology, Inc in Boise, , United States and grow with us.
The position is based in Boise, , United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 110..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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