HBM Yield Enhancement & Failure Analysis Engineer
Listed on 2026-10-07
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Engineering
Quality Engineering, Test Engineer
Micron Technology, Inc. in Boise, Idaho, seeks a Level 2 or 3 HBM Product Yield Enhancement PDFA Engineer to drive failure analysis from design to mass production on the PDFA team.
You will perform electrical, physical, and statistical analyses to identify failure mechanisms and use AI-enabled tools to improve yield and reliability. You will collaborate with Product, Process, Test, Quality, and Manufacturing teams to resolve fabrication, assembly, and test-related issues, supporting rapid ramp
This role is for the HBM Yield Enhancement & Failure Analysis Engineer role at Micron Technology, Inc.
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This posting is for the HBM Yield Enhancement & Failure Analysis Engineer role at Micron Technology, Inc, based in Boise, , United States.
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