DRAM Process Integration Engineer — Shape -Gen Memory
Listed on 2026-10-07
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Engineering
Process Engineer, Electronics Engineer, Manufacturing Engineer, Systems Engineer
Micron Technology in Boise, Idaho, is seeking a Process Integration Engineer for its DRAM R&D Memory Group to advance next-generation memory technology. You will develop structural and electrical requirements for modules and collaborate with Design, Process Development, Yield, and Manufacturing to transfer new solutions into production.
Responsibilities include designing new process flows, specifying design rules, running DOE studies, and using data analysis to improve yield and reduce cost.
We would love to welcome a new DRAM Process Integration Engineer — Shape Next-Gen Memory to our team in Boise, , United States.
This is a great position to take on the DRAM Process Integration Engineer — Shape Next-Gen Memory role at Micron Technology.
As a DRAM Process Integration Engineer — Shape Next-Gen Memory, you will play an important part at Micron Technology in Boise, , United States.
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