Senior Process Engineer: Chip-to-Wafer & Hybrid Bonding
Listed on 2026-10-07
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Engineering
Process Engineer, Systems Engineer
Micron Technology, Inc in Boise, Idaho is seeking a Senior Process Engineering Technical Leader to advance chip-to-wafer and hybrid bonding processes for innovative 3D memory products. This role requires a Master’s or PhD and 13+ years of semiconductor R&D experience.
You will lead multidisciplinary efforts that bridge early development to high-volume manufacturing, ensuring product reliability and performance. The position offers comprehensive benefits including medical options, paid time off, and family leave.
Join Micron and contribute to transforming how the world uses information.
We would love to welcome a new Senior Process Engineer:
Chip-to-Wafer & Hybrid Bonding to our team in Boise, , United States.
Join Micron Technology, Inc and contribute to our ongoing work.
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