Senior Materials Engineer: -Gen Memory & 3D Packaging
Listed on 2026-10-11
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Engineering
Materials Engineering, Packaging Engineer, Manufacturing Engineer, Process Engineer -
Manufacturing / Production
Materials Engineering, Packaging Engineer, Manufacturing Engineer
Micron Technology, Inc. in Boise, Idaho seeks a Senior Materials Engineer/Scientist to define and enable materials foundations for next-generation memory and advanced packaging technologies, including HBM and 3D memory.
You will develop, characterize, and integrate new materials with cross-functional teams to drive performance, reliability, and cost improvements. The role involves hypothesis-driven experiments, data analysis, and close collaboration with process, product, manufacturing, quality,
The Senior Materials Engineer:
Next-Gen Memory & 3D Packaging role at Micron Technology, Inc. is now open for applications in Boise, , United States.
We invite applications for the Senior Materials Engineer:
Next-Gen Memory & 3D Packaging position located in Boise, , United States.
The following opportunity is for a Senior Materials Engineer:
Next-Gen Memory & 3D Packaging with Micron Technology, Inc.
Our organisation is growing, and we are hiring a Senior Materials Engineer:
Next-Gen Memory & 3D Packaging in Boise, , United States.
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