Senior Thin-Film Engineer, Advanced Packaging & R&D
Listed on 2026-10-11
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Engineering
Process Engineer, Packaging Engineer, Manufacturing Engineer, Research Scientist
Micron Technology is seeking an experienced Process Engineer in Boise, Idaho, specializing in thin film deposition for Advanced Packaging R&D. You will develop and optimize deposition processes, collaborating with process integration, yield, and equipment teams to translate ideas into manufacturing-ready solutions.
Requirements include an MS/PhD in a related field and 7+ years in advanced packaging with thin film deposition; strong data analysis, DOE, thermodynamics, and kinetics knowledge; plus
The Senior Thin-Film Engineer, Advanced Packaging & R&D role at Micron Technology is now open for applications in Boise, , United States.
Join us at Micron Technology as our next Senior Thin-Film Engineer, Advanced Packaging & R&D in Boise, , United States.
We are currently recruiting a Senior Thin-Film Engineer, Advanced Packaging & R&D for our team in Boise, , United States.
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