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Senior Materials Engineer, Advanced Packaging & 3D Memory

Job in Boise, Ada County, Idaho, 83701, USA
Listing for: 1000 Micron Technology, Inc.
Full Time position
Listed on 2026-10-12
Job specializations:
  • Engineering
    Materials Engineering, Packaging Engineer, Process Engineer, Quality Engineering
Salary/Wage Range or Industry Benchmark: 120000 - 170000 USD Yearly USD 120000.00 170000.00 YEAR
Job Description & How to Apply Below

1000 Micron Technology, Inc. in Boise, Idaho seeks a Senior Materials Engineer/Scientist for Advanced Packaging Technology Development to define the materials foundation for next-generation memory and packaging technologies.

You will develop and integrate new materials, improving performance, reliability, and cost. You will collaborate with cross-disciplinary teams and external partners, drive experiments, analyze data, and apply AI tools to accelerate solutions in areas like die-attach

Our organisation is growing, and we are hiring a Senior Materials Engineer, Advanced Packaging & 3D Memory in Boise, , United States.

We invite applications for the Senior Materials Engineer, Advanced Packaging & 3D Memory position located in Boise, , United States.

The following opening is for a Senior Materials Engineer, Advanced Packaging & 3D Memory with 1000 Micron Technology, Inc.

Our team is growing, and we are hiring a Senior Materials Engineer, Advanced Packaging & 3D Memory in Boise, , United States.

Position Requirements
10+ Years work experience
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