Senior Materials Engineer — Advanced Packaging & 3D Memory
Listed on 2026-10-12
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Engineering
Materials Engineering, Packaging Engineer, Process Engineer, Quality Engineering
Micron Technology, Inc. is seeking a Senior Materials Engineer/Scientist in Advanced Packaging Technology Development to define and enable materials foundations for next-generation memory and packaging technologies.
You will collaborate with teams to turn scientific insight into technology impact, exploring interfaces, adhesion, and thermal performance, while advancing materials for HBM, 3D memory, and heterogeneous integration.
We invite applications for the Senior Materials Engineer — Advanced Packaging & 3D Memory position located in Boise, , United States.
As a Senior Materials Engineer — Advanced Packaging & 3D Memory, you will play an important part at Micron Technology, Inc. in Boise, , United States.
The following opening is for a Senior Materials Engineer — Advanced Packaging & 3D Memory with Micron Technology, Inc.
Our organisation is growing, and we are hiring a Senior Materials Engineer — Advanced Packaging & 3D Memory in Boise, , United States.
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