Principal Thin Films Engineer, Advanced Packaging

## Principal Thin Films Engineer, Advanced Packaging Boise, Idaho, United States of America Apply Now Find out how well you match with this jobJob :
JR113968
** Our vision is to transform how the world uses information to enrich life for
* all*.
** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
** Department Overview:
** The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of ground breaking memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies.  
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* Position Overview:

** We are seeking an experienced Process Engineer with expertise in depositing thin films who will thrive in a fast paced and results oriented environment! Our goal is to employ robust solutions to thin film challenges that meet the detailed physical and electrical requirements for Micron’s industry-leading memory products. In this role, you will develop and optimize novel solutions to film deposition challenges for the next generations of Micron’s memory systems.

You will to take ideas from conception through development and implementation in manufacturing. Best-qualified candidates will have deep subject matter expertise in Thin Films in semiconductor Advanced Packaging R&D roles.  We offer a highly collaborative and innovative atmosphere, allowing you to interact with various groups including process integration, electrical failure analysis, yield enhancement, manufacturing, and various semiconductor equipment manufacturers. You will have the opportunity to drive and define Micron’s thin film technology roadmaps, generating intellectual property which will have a direct influence on our global industry leadership.

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* Job Responsibilities:

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* * Develop, optimize, and characterize thin film processes to meet the requirements of pioneering advanced packaging products
* Collaborate with process integration and other process development teams to develop innovative solutions
* Optimize deposition processes to reduce cost, process variability, GHG emissions, and improve process capability
* Conducting root cause and failure mode analysis to understand the limitations of current hardware and engaging vendors for solutions
* Maintaining a technology development pilot manufacturing line
* Support process transfer to production facilities (some minimal travel may be required)  
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* Minimum Qualifications:

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* * MS or PHD in Materials Science, Chemical Engineering, Chemistry, Physics, or other related technical fields
* 7+ years of industry experience in Advanced Packaging with specialization in thin film deposition and characterization. Understanding of growth and characterization of thin films is required
* Proficiency with data analysis, DOE, and statistical techniques
* Knowledge of thermodynamics, chemical kinetics and their direct application to films deposition
* A history of using strong analytical and creative problem-solving skills paired with extensive technical knowledge to guide decisions and strategies for projects  
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* Preferred Qualifications:

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* * Experience with plasma processing and its impact on film properties are plus
* Experience in programming/scripting/automation and creation or regular use of AI agents

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision…