Senior Thin-Film Deposition Engineer, Advanced Packaging
Listed on 2026-10-15
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Engineering
Packaging Engineer, Manufacturing Engineer, Process Engineer, Quality Engineering
Micron Technology, Inc. in Boise, Idaho, is seeking a Principal Thin Films Engineer focused on advanced packaging.
You will develop, optimize, and characterize thin film deposition processes to meet the stringent requirements of next-generation memory products, working with process integration and failure analysis teams. Ideal candidates have 7+ years in advanced packaging, strong data-analysis and DOE skills, and a proven ability to drive from concept through production while reducing cost and
The following opening is for a Senior Thin-Film Deposition Engineer, Advanced Packaging with Micron Technology, Inc.
Step into the Senior Thin-Film Deposition Engineer, Advanced Packaging role at Micron Technology, Inc. in Boise, , United States and grow with us.
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