AI-Driven Wafer Bonding Equipment Engineer
Listed on 2026-10-15
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Engineering
Electronics Engineer, Process Engineer, Electrical Engineering, Manufacturing Engineer
Micron Technology, Inc. is seeking an Equipment Development Engineer for Wafer Bonding in Boise, Idaho. The role focuses on developing next‑generation FAOK wafer bonding equipment, collaborating with suppliers, and delivering hardware solutions from concept to manufacturing.
You will own equipment performance, drive improvements in overlay and alignment, and contribute to the equipment roadmap. Travel is anticipated 5–10% for supplier development and cross‑site collaboration.
Step into the AI-Driven Wafer Bonding Equipment Engineer role at 1000 Micron Technology, Inc. in Boise, , United States and grow with us.
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This posting is for the AI-Driven Wafer Bonding Equipment Engineer role at 1000 Micron Technology, Inc., based in Boise, , United States.
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