Lead Wafer Bonding Equipment Engineer – FAOK Innovation
Listed on 2026-10-16
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Engineering
Manufacturing Engineer, Mechanical Engineer, Electrical Engineering, Process Engineer
Micron Technology, Inc. is seeking an Equipment Development Engineer for wafer bonding who will own equipment-development challenges from concept through manufacturing implementation.
You will work with suppliers on new hardware and subsystems, and apply data-driven approaches to improve system performance. The role requires a strong background in mechanical/electrical integration, overlay, and bonding processes, with hands-on development and collaboration across process, manufacturing, and
We are seeking a motivated Lead Wafer Bonding Equipment Engineer – FAOK Innovation to join Micron Technology, Inc. in Boise, , United States.
The position is based in Boise, , United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 90..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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