Wafer Bonding Equipment Engineer – FAOK & AI-Driven
Listed on 2026-10-16
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Engineering
Mechanical Engineer, Electrical Engineering, Process Engineer, Manufacturing Engineer
Micron Technology, Inc. in Boise, Idaho is seeking an Equipment Development Engineer for Wafer Bonding to own equipment development from concept through manufacturing, collaborating with suppliers and cross-functional teams.
The role focuses on wafer bonding, alignment, overlay, modeling, automation, and data analytics to push capabilities forward; requires a B.S. in Mechanical Engineering and 4+ years in semiconductor equipment.
We are currently recruiting a Wafer Bonding Equipment Engineer – FAOK & AI-Driven for our team in Boise, , United States.
The Wafer Bonding Equipment Engineer – FAOK & AI-Driven position in the Engineering field is open for applications.
We have an opening for a Wafer Bonding Equipment Engineer – FAOK & AI-Driven in Boise, , United States within Engineering.
This role, Wafer Bonding Equipment Engineer – FAOK & AI-Driven at Micron Technology, Inc., could be your next opportunity.
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